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Furukawa Electric is a global leader in customized thermal solutions, pioneering a full range of thermal managem

 

ent technologies

for small hand-held devices, laptop and desktop PCs, and industrial applications. Our experienced thermal engineers work closely with you to develop a cost-effective design to meet your performance and form factor requirements.


Lead-Free Crimped Fin® and Stacked Fin Heat Sinks
Furukawa’s Crimped Fin® and Stacked Fin design technology combines copper and aluminum materials into one heat sink without soldering. This minimizes material and manufacturing costs while meeting lead-free requirements. Furukawa has expanded its high-volume manufacturing capacity of heat sinks in China and is an approved Intel® Reference Design heat sink supplier.


Advanced Heat Pipe Integration
We integrate a diverse range of heat pipe technology into our thermal solutions to maximize performance and meet difficult form factors. Our grooved heat pipes are unmatched in performance and reliability. Furukawa’s new Pera-Flex® product is amazingly pliable and can be manufactured to a thickness as small as 0.55mm -- ideal for today's growing market of hand-held devices.


New Thermal Electric Cooling Technologies
Contact us for the latest information on our next-generation thermal electric cooling technologies including vapor chambers and specialized CPU processor solutions.

 

Intel Data Sheets

Data Sheet - 1U Intel® Xeon Heat Sink.pdf 207.2KB

Data Sheet - 2U Intel® Xeon Heat Sink.pdf 211.8KB

 

 

 

  

Product Data

Data Sheet - Thermal Interface Material.pdf 223.5KB
Catalog Total Thermal Solutions.pdf 2.4MB
Tech Abstract Crimped Fin® Heat Sink.pdf 463.2KB
Tech Abstract Ultra-Thin Pera-Flex® Heat Pipe.pdf 162.9KB
Tech Abstract 1mm Micro Heat Pipe.pdf 41.1KB